K2 Pro + DXC2 Thermal Investigation & Possible Filament Sensor Heat Issue
Just wanted to share some findings from my K2 Pro + DXC2 setup as I think I may have found part of the reason behind some of the heat-related issues people are seeing on these machines.
This is still a work in progress and NOT a confirmed permanent fix yet, but so far the results are looking promising.
Background
I mainly print enclosed ABS/engineering materials and regularly run the chamber at high temperatures for long periods.
Over time I started getting increasingly strange filament sensor behaviour:
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sensor saying filament was still loaded when it wasn’t;
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LED brightness changing randomly;
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intermittent detection;
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occasional false triggers;
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eventually the sensor stayed permanently “on”.
Disconnecting the sensor instantly fixed the issue, so it looked local to the sensor/extruder area rather than the main board.
What I Found
After taking the DXC2 apart multiple times I noticed:
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sticky/shiny residue around the rear magnet area;
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signs of heat affecting the rear extruder cavity;
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the rear section around the sensor getting VERY heat soaked;
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almost no thermal isolation between the extruder motor and the extruder body.
My current theory is that prolonged chamber heat + extruder motor heat is saturating the rear cavity and affecting the filament sensor area over time.
What I’ve Changed So Far
Current Modifications
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replaced the filament sensor;
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added Kapton tape insulation between the sensor PCB and the extruder body;
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added a 0.7 mm mica thermal barrier between the motor and extruder body;
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cut airflow relief sections into the mica so airflow can still pass through;
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currently designing/testing a vented rear cover to help the motor dump heat better.
What The Goal Is
The aim is basically to:
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reduce heat transfer into the sensor area;
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stop possible PCB contact with the rear magnet/body;
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improve rear cavity airflow;
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reduce heat soak around the sensor and rear extruder cavity.
Results So Far
So far the results are actually looking pretty good:
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sensor now behaves properly;
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no filament = LED fully off consistently;
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loading/unloading works normally again;
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nozzle PID is rock solid;
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bed temperature stability is excellent;
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MCU temperature is stable and tracking chamber temp normally;
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no obvious thermal instability from the modifications.
Current Thermal Testing
I’ve currently been heat soaking the machine with:
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100°C bed
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140°C nozzle
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60°C chamber target
At idle the machine is sitting around the low 50s chamber temperature without anything going unstable.
So far:
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nozzle temp stability is excellent;
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bed temp stability is excellent;
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MCU temps appear controlled;
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no crazy temperature spikes or thermal runaway behaviour.
Next Steps
Next stage is:
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finish the vented rear cover;
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run longer-duration print testing;
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perform proper ABS heat soak testing under real extrusion load;
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monitor the rear cavity and sensor area over extended print durations.
My Current Thoughts
I honestly think the K2 can do high chamber temperatures, but some areas of the toolhead/extruder seem a bit thermally marginal once you start doing long engineering-material prints regularly.
The rear motor/sensor cavity specifically seems like a potential weak point under prolonged heat soak conditions.
Interested To Hear From Others
Would be interested to know if anyone else has seen:
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sticky residue near the rear magnet/sensor area;
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sensor weirdness after heat soak;
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DXC2 heat creep;
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FO0528/disengage type issues;
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rear cavity getting extremely hot;
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filament sensor failures after long ABS/ASA prints.
Hopefully this helps someone else chasing similar problems.

